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Date: 06/25/01 at 2:26 PM
Posted by: Dave B
E-mail: daveb@motioneng.com

We currently use a HASL finish on all our circuit boards. As we move to micro-BGAs and < 20 mil pitch components it is becoming necessary to consider alternatives. Nickel-gold, Immersion silver, White Tin, and OSP seem to be the predominant choices. As best I can tell, OSP will not be a good candidate due to its short shelf life and that we have use double sided boards. Gold has the "BLACK PAD" phenomenon and I'm sure each has their pros & cons. Can anyone tell me the upside/downside of each technology? My goal is to understand the technology so that I may make an informed choice, especially since I have to live with it!

Regards,

Dave B
Motion Engineering, Inc.
Santa Barbara, CA

Follow Ups:

  Re: alternatives to HASL Robert   Posted at: 07/16/01 (2)

  Re: alternatives to HASL DaveB   Posted at: 07/16/01 (1)

  Re: alternatives to HASL Robert   Posted at: 07/16/01 (0)

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