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Subject: Re: Pro's & Con's of MicroVia Technology

Date: 09/23/02 at 5:14 PM
Posted by: Luc Champagne
E-mail: lchampagne@cmles.com
Message Posted:

In Reply to: Re: Pro's & Con's of MicroVia Technology posted by Roger Simpson on 10/15/01 at 3:47 AM:

Hi,

I am interested by the microvia technology and I would like to know more about it. We are using 0.062 mils tickness pcb with dimensions 13.386 in x 9.189 in (10 layers pcb, 6187 pads, 4000 vias, 3717 holopads, 1300 nets both side components).

Is it possible to use microvia on 0.062 mils pcb tickness? Right now we are using via 0.020 pad with 0.010 drill.
What are the advantages and disadvantages of using microvia ?
What are the risk associated with that technology?
Is this more expensive than a pcb made with 20R10 specifications ?
If it is more expensive, could you tell me by how much (pourcentage) ?
What kind of problems could we expect with that techmology?
Is this a technology well accepted in the telecom industry?
Is this a mature technology?

Looking forward to receiving your reply

Regards

Luc Champagne


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