[ List Subjects ][ Current Board ][ Post Message ]
[ View Followups ][ Post Followup ]

Date: 10/15/01 at 3:47 AM
Posted by: Roger Simpson
E-mail: rrsinnova@hotmail.com

In Reply to: Pro's & Con's of MicroVia Technology posted by Steve on 10/13/01 at 6:23 PM:

Hi Steve,

I have designed several Micro via PCB’s, and as I see it the Pro’s are of course the ability to break out micro BGA devices of say 0.8mm, and via’s in Surface Mount Pads, thus being able to achieve a higher packaging density, and as microvia sometimes is the only way to achieve very populated designs, then that is the argument I would use.

The downside is more expensive materials used to manufacture the PCB such as a Thermount capping of a FR4 core, and more captive PCB’s shop’s as this process is still available to some and not all manufacturers, so your local shop probably could not make the prototypes.

You can of course use Micro-vias down to 3 layers as well, and as you do not just have to drill holes with a laser. some interesting side technologies are coming about from laser ablating PCB’s, such as in the realms of High Speed Interconnect and direct chip attach.

Follow Ups:

  Re: Pro's & Con's of MicroVia Technology Luc Champagne   Posted at: 09/23/02 (2)

  Re: Pro's & Con's of MicroVia Technology janet lozano   Posted at: 10/02/03 (0)

  Re: Pro's & Con's of MicroVia Technology Karthik S   Posted at: 09/30/03 (0)

Post a Follow-up:

Name:
E-Mail:
Subject:

Message to Post: