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Date: 10/10/01 at 3:44 AM
Posted by: Adam Seychell
E-mail: aseychell@vet.com.au

Could someone explain the process of making holes conductive
using carbon colloids ? I understand this is relatively
new process in the PCB industry for the replacement of
electroless copper. I have been experimenting on small scale
with an off the shelf carbon black dispersion (conductive
type). Diluting the carbon dispersion concentrate followed
by panel dipping can produce holes conductive enough for
hole wall plating. However, one of the problems I'm
experiencing is slow hole plating times due to high
carbon resistance. The holes do not fully plate with
copper until the first 5 to 7 um of copper has been
deposited on the tracks. Resistances measured proir to
electroplating are approximatly 6-8 kOhms per hole of
1 mm diameter. Can anyone comment on this ?

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