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Date: 07/16/01 at 4:03 PM
Posted by: Robert
E-mail: rvalles@vikingcomponents.com

In Reply to: alternatives to HASL posted by Dave B on 06/25/01 at 2:26 PM:

Dave
I understand your position exactly. i just recently specified ENIG as the preffered finish for BGA. I asked our ME group to assemble samples of HASL, Silver and immersion gold. We stayed away from the OSPs primarily because of shelf life, handeling and process paramaters. We had our greater success with the silver and gold but we could not get above a 80% first pass yield. I found a process known as PPT, a process that predeposits a 1 to 1 ratio of solder. Our process requires we deposit a tacky flux only. Since we have moved in this dirrection, our 1 pass yields now range from 93% to 97% pre re-work. Alot of people may frown on the PPT process as a band aid, but the yields are working for us right now. As for the ENIG, I have not experienced any issues to date in the way of black pad.
For non-BGA we still use HASL, our cutof point for ENIG is <.018 mil pitch.

Robert

Follow Ups:

  Re: alternatives to HASL DaveB   Posted at: 07/16/01 (1)

  Re: alternatives to HASL Robert   Posted at: 07/16/01 (0)

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