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Subject: Diamond pads for BGA's ??

Date: 01/22/01 at 10:55 AM
Posted by: Rickey Free
E-mail: rickey.fre@acdesign.com
Message Posted:

I hear Cisco is using diamond shaped pads for the footprints of BGA's. Apparently it's improving the solderability. I don't have any other information. Do you?

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