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Subject: Re: solderability issues?
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Date: 07/31/01 at 12:05 PM
Posted by: James Whitehouse
In Reply to: solderability issues? posted by Carl Goldenbusky on 07/31/01 at 8:09 AM:
What you may be experiencing there is oxidisation of the pads. I imagine you have quite a long process time considering the type of board, this wont help either. About migration of copper through tin.....well, I dont know, I used to see that give problems sometimes in IR ovens, but other than that, I never understood what the fuss was about. In my opinion, if you are pushing a process to the point where that becomes apparent, then you would certainly have a whole bunch of other problems as well. I will try to dig out some documentation in the morning, I can also ask the guys at Bang & Olufsen, i´m there on thursday. I seem to remember som similar discussions with them a couple of years back.
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