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Subject: solderability issues?
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Date: 07/31/01 at 8:09 AM
Posted by: Carl Goldenbusky
We are having a real process problem here or at least that is my perception.
Here is a description of our problem :
We have an 8 layer pcb that contains 3 gnd planes and 1 powerplane on the internals and has fine pitch parts on both sides.
For testing purposes we paste one side of a bare board run it through the reflow ,clean it that side then paste and run the second side solder seems as if it will not reflow on side 2 it melts but does not flow evenly over the pads.
This is a major concern is this caused by copper migration through the tin? any one seen this before?
Thanks in advance.
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