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Subject: Solder Paste Dispensing

Date: 06/07/00 at 7:52 AM
Posted by: Jeff
E-mail: jhallman@raytheon.com
Message Posted:

My goals are to find a repeatable and reliable method to dispesne 50Pb/50In solder paste onto
populated substrates for rework applications. My specs are: 0.010 in (10 mil) diameter dots with
0.016 in (16 mil) pitch spacing. I realize the very highly viscous and fragile lead-indium solder
paste properties and my tight specs, but have seen consistent needle dispensing methods with
Sn63 paste down to the size I'm looking for. I also understand that piston positive displacement
pumps may be the best choice, but would be interested in any new technology that is available.
Thanks

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