[ List Subjects ][ Current Board ][ Post Message ]
Subject: Re: cvc 601 sputtering machine
[ View Followups ][ Post Followup ]
Date: 01/30/03 at 5:13 PM
Posted by: Vacminho-Coatings and Surface Engineering Ltd
In Reply to: cvc 601 sputtering machine posted by Abhiram Govindaraju on 12/08/02 at 7:39 AM:
You should read carefully the answer from Donald Mattox. I advise you to read about sputtering technology and some vacuum technology.
If you see a plasma, then to get a film on your wafer you should :
i) use a working distance compatible to the mean free path. (genrally 100 mm is ok for the pressure ragnes of spuutering).
ii) depending on the power, and time you need some time to have a finite thickness.
iii) if your layer is transparent you do not see it!
iv) be aware if your system has am automatic shutter and if it is moved for deposition.
v) the ion gauge cannot read precisely the pressure, that why you have low pressure where no sputtering can occur!
Post a Follow-up: