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Subject: Re: SiO2 rf magnetron sputtering

Date: 10/09/01 at 2:55 PM
Posted by: Ted Van Vorous
E-mail: cathodes@uswest.net
Message Posted:

In Reply to: SiO2 rf magnetron sputtering posted by Mike C on 10/09/01 at 5:49 AM:

Use a slightly higher argon pressure than for
DC magnetron, ie,3-5 microns. Dope with some
oxygen at about 10%if the film has a yellowish or
brownish color indicative of SiOx, ie, loss of
some oxygen in the SiO2 during deposition.
It is extremely difficult to deposit films free
of microporosity.
Ted V V

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