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Subject: Re: Diference between planar and unballanced magnetron sputtering
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Date: 01/17/02 at 4:51 PM
Posted by: Vladimir Tchoutko
In Reply to: Diference between planar and unballanced magnetron sputtering posted by Nuno Lima on 01/15/02 at 11:07 AM:
The main difference between balanced magnetron and unbalanced one is the following: The magnetic field of balanced magnetron is concentrated strongly close to target surface. In unbalanced magnetron the part of magnetic field is directed to substrate creating a kind of channel where plasma can reach the substrate. As a result of plasma influence on substrate you obtain the coating with a very good adhesion, density and other parameters. But substrate is heated much more! Advantages and disadvantages of unbalanced magnetron depend on your goal - if your substrate do not afraid of heating and plasma bombardment - it should be OK. To convert balanced magnetron to unbalanced you have either to change magnetic system design, or to add an extra magnetic system.
By the way, what is the result of your contacts with people I've reccomended?
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