[ List Subjects ][ Current Board ][ Post Message ]
Subject: Re: To FRIL of email@example.com
[ View Followups ][ Post Followup ]
Date: 08/11/01 at 6:21 PM
Posted by: FRIL
In Reply to: To FRIL of firstname.lastname@example.org posted by charlie on 07/25/01 at 11:20 AM:
I told you only about method of preparing of surface before coating.
In my experiments with Al coats I was using an arc sources of Al plasma. And adhesion was normal for both and think and thick films (max 10 mkm).
I donít know how good will this technique for heat-resistant evaporation. But I think it also must take a good result.
I havenít possibility now to made this experiment (with heat-resistant evaporation.) And It will interesting for me to know news from you.
Post a Follow-up: