[ List Subjects ][ Current Board ][ Post Message ]
Subject: Position-Electronic Packaging Leader-NY
[ View Followups ][ Post Followup ]
Date: 02/11/00 at 1:07 PM
Posted by: Kim
THIS IS FOR OUR TOP CLIENT'S CORPORATE R&D CENTER.
THERE ARE 1500 PEOPLE HERE;AMONG THEM PH D'S, SCIENTISTS AND TECHNICIANS.
They develop products but also serve as advisors and team leaders to the corporation's other businesses such as appliances,jet engines, plastics, electrical
distribution and control, information systems, a television network and medical systems.
Principle responsibilities involve leadership of applied research and development in innovative
improvements in the areas of electronics packaging and assembly.
Candidate will develop new technologies with higher I/O density,improved thermal performance,improved manufacturing yields and improved reliability. Candidate will also develop outside sources for advanced electronics packaging technologies and qualify electronics packaging approaches from outside vendors.
This individual will also design packaging for the company's products and resolve issues with electronics
packaging for the other internal corporate businesses mentioned above.
1.MS or PhD degree in electronics,physics, materials or M.E. with at least 10 years experience
2.Expertise in many of the following:
semiconductor packaging,hybrid/MCM (multi-chip module)
packaging, CSP (chip-scale packaging), flex connect,
wirebonding, PCB and PWA(printed wire assembly) fabrication and assembly, encapsulation and
To submit your resume please send it in a word.doc to:
129 Main Street
Old Saybrook, CT 06475
Post a Follow-up: