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Subject: Re: Looking for Job in VLSI / ASIC

Date: 04/25/03 at 3:49 AM
Posted by: Roman Danilov
E-mail: romandanilov@front.ru
Message Posted:

In Reply to: Looking for Job in VLSI / ASIC posted by Nitu Singh on 03/04/03 at 1:18 AM:

CV

Dear Sir/Madam

My position is Head of CD SEM laboratory (34 male, single). The main areas of my experience (7years) in
semiconductor IC fabrication can be outlined as Metrology, Inline measurement, Defect metrology (in line inspection, of line review), Failure analysis, Statistical metrology for yield. Having fundamental knowledge of physics, metrology, statistics, technology (Moscow Institute of Electronic Technology Department of Theoretical and Experimental Physics) and professional skills in wide range of measurement methods (SEM, Spectrometry, Ellipsometry, FTIR, Thermawave, Laser scaterometry …CD, Overlay, Film thickness and Refractive index measurement…see resume for more details) I am going to develop my carrier. It would be interesting to discuss your proposals.
Roman Danilov

RESUME

Name:
Roman Danilov
Date of Birth:
01/09/69
Place of birth:
Yuzno-Sakhalinsk, Russia
Address:
445-44,Zelenograd,103498 Moscow, Russia
Home tel +7(095)5306926
e-mail: romandanilov@front.ru

Education:
-1989-1995
Moscow Institute of Electronic Technology
Department of Materials and Components for microelectronics
Thesis: CVD of high-temperature superconductor films YBa2Cu3O7.
-1995-1997 Post graduate student
Moscow Institute of Electronic Technology
Department of Theoretical and Experimental Physics.
Nanotechnology, Tunneling&Atomic force microscopy/Design Engineer.

Experience:
May2002
“Angstrem” JSC-IC design and fabrication,
Zelenograd, Moscow, Russia
Head of CD SEM laboratory
Responsible for;
-CD measurement (CD SEM HITACHI S-6200H)
-Overlay measurement
-Defect metrology (in line inspection, of line review)
-Failure analysis
-Statistical metrology
-Tuning and optimization of measurement process
-Calibration and monitoring of measurement tools
-Definition of accuracy, repeatability, reproducibility, stability (sources of variation analysis)
- Edge detection algorithm optimization
-Calibration of magnification (CD SEM)
-Estimation of sharpness\resolution and astigmatism (also by miens of 2D Fourier transform)
-Axial alignment of electron optics (electron gun, condenser lens, intermediate lens, movable aperture, stigmator coil, autofocus coil)

May 2000 - May 2002
Since Research Institute of System Analysis
Moscow, Russia.
Group Leader of metrology.
Responsible for;
-In line measurement,
-Defect metrology (in line inspection, of line review)
-Tuning and optimization of measurement process
-Calibration and monitoring of measurement tools
- Estimation of accuracy, repeatability, reproducibility, stability (sources of variation analysis)
-Film thickness and Refractive index measurement, Spectrometry, Ellipsometry (NANOSPEC 8000)
-CD measurement (DUV and SEM)
-TXRF- contamination analysis
-Thermawave- dose measurement and metal films thickness measurement
-Surface profiling and analysis,
-Thin films stress measurement,
-Surface particle contamination analysis ( Laser scaterometry).
-Sheet resistance measurement

February1998-May 2000
JSC “Korona Semiconductor, Ltd”
Chip maker foundry
Zelenograd, Moscow, Russia
Leading Engineer of metrology.
Responsible for;
-In line metrology
-Defect metrology
-Statistical metrology
-Tuning and optimization of measurement process
- Calibration and monitoring of measurement tools
- Film thickness and Refractive index measurement, Spectrometry, Ellipsometry
-CD measurement
-FTIR. Measurement of concentration P in PSG. Epitaxial silicon layer
thickness measurement
-Surface profiling and analysis
-Sheet resistance measurement
-Surface particle contamination analysis (Laser scaterometry)

September 1995-June 1997
Moscow Institute of Electronic Technology
Moscow, Russia
Department of Theoretical and Experimental Physics.
Nanotechnology, Tunneling&Atomic force microscopy/Design Engineer

March 1993- February 1995
Since Research Institute of Materials for Microelectronics
Zelenograd, Moscow,Russia
CVD of high-temperature superconductor films YBa2Cu3O7 \Technical assistant.

Projects:
Automatic control system for tunneling microscope (patent in Russia)

Technical Skills:
-CD SEM HITACHI S-6200H (HITACHI)
-Film thickness measurement system NanoSpec 8000 XSE (Nanometrics)
-Profile and stress measurement system Dektak V 200 SL (Veeco)
-Thermawave dose and metal film thickness measurement system
TWIN SC2 (TEPLA)
-Optical microscope with CD measurement option Leica INM 300 DUV (Leica)
-Particle contamination measurement system REFLEX 300 (Nanophotonics)
-FTIR wafer tester SSS 05 (St P instruments cor.)

Publication:
-Multitip scanning tunneling microscopy
Abstracts of "Microelectronics and Informatics"
Conference 1996,Moscow, Russia, p.9
-Tunneling current and space (tip-to-sample) control system.
-Patent ¹2100868 Priorities 26 December 1996 ¹96108564 (in Russia)

Computer skills:
Platforms: DOS, Windows 95/98/2000NT
MS Word, MS Excel, Statistica.

Relevant Courses:
Metrology, Statistical Theory of measurement, Yield management, Ellipsometry, Fourier-transform spectroscopy, Scanning Electron Microscopy theory, Solid State Physics, Physics of Semiconductors, Physics of Superconductor, Physics of Semiconductor Devices, Thin Film Physics,


Languages:
Fluent English



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