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Subject: US-Midwest: Wireless/RF/DSP Engineer

Date: 01/02/02 at 1:12 PM
Posted by: Bridget Arneson
E-mail: barneson@bondtechnologies.com
Message Posted:

US-Midwest: Wireless/RF/DSP Engineer

Have you ever wanted the opportunity to get in on the ground floor, make an impact - and be rewarded for your performance? Here's your chance!

We are currently seeking a seasoned EE w/ strong wireless/RF & DSP experience. The engineer will work on areas such as system-on-chip, wireless LAN's, point-to-point radios on a chip, wireless internet connectivity, as well as standard parts such as amps, mixers, etc. Most work will be in the under 6 GHz range.

Our client is an established, prestigious company that's growing an ASIC Design Center of Excellence. It's an excellent opportunity to help build a custom design center and work with a high number of advanced degreed, extremely strong, talented engineering staff. They concentrate on very high level, custom design work for select customers.

Benefits are outstanding including a competitive salary and excellent relocation package.

Please e-mail me today to find out more information about this exciting position or call Mark Cline at 952-841-9501.

Thank you for taking the time to read this and for your assistance.

Bridget Arneson
Barneson@bondtechnologies.com
Bond Technologies
7400 Metro Boulevard, Suite 100
Edina, Minnesota 55439-2311

Bond Technologies is a consulting firm
that specializes in assisting select,
exclusive companies with their
recruitment efforts, primarily in cutting
edge engineering development.
_______________________________________________
Keywords: ASIC, VLSI, RF, Radio Frequency, Wireless, Research, Communications, Broadband, DSP



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