The client is a fast growing company developing automated inspection and yield management solutions for the semiconductor and PCB industry. The company is poised to grow to 100 Million plus in the next three years.
Experienced technical engineers are needed immediately to work with client’s partners and customers in a pre/post sale service capacity. Qualified candidates will have at least 2 years of wafer fabrication process/equipment engineering experience in Photo, Etch, CMP, Thin Film, Diffusion, Yield Enhancement or 3 years of applications engineering with semiconductor equipment manufacturer of process or metrology systems, strong verbal and written communication skills, quick problem-solving and critical thinking skills along with a “can-do” attitude. Proven experience in software testing and QA. The Application Engineer assists customers with the; use of products, trouble-shooting technical problems and is the front line point of contact for all production support issues.
Required Skills: 2 years of wafer fabrication process/equipment engineering experience in Photo, Etch, CMP, Thin Film, Diffusion, Yield Enhancement
Or 3 years of applications engineering with semiconductor equipment manufacturer of process or metrology systems
Specific experience with wafer inspection systems
Reports using MS Excel/Word
Strong verbal and written communication
Ability to lift at least 50 lbs. and work in a confined space for lengthy periods of time.
Able to travel
Preferred Skills: Understanding electrical schematics and machine design Basic mechanical design
Education: Minimum: Engineering or Equivalent
Benefits: Stock Option, Bonus, Health/Dental Insurance, Life
Salary: Commensurate with prevailing wage and experience
Location: Dallas Texas, City of Richardson