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Subject: US-Midwest: Digital/DSP Engineer

Date: 04/12/02 at 3:45 PM
Posted by: Bridget Arneson
E-mail: barneson@bondtechnologies.com
Message Posted:

US-Midwest: Digital/DSP Engineer

Have you ever wanted the opportunity to get in on the ground floor, make
an impact - and be rewarded for your performance? Here's your chance!

We are currently seeking a seasoned EE w/ strong Digital/DSP and
communications experience. The engineer will work on areas such as
system-on-chip, wireless LANís, point-to-point radios on a chip,
wireless internet connectivity, as well as standard parts such as amps,
mixers, etc. Most work will be in the under 6 GHz range.

Our client is an established, prestigious company thatís growing an ASIC
Design Center of Excellence. Itís an excellent opportunity to help
build a custom design center and work with a high number of advanced
degreed, extremely strong, talented engineering staff. They concentrate
on very high level, custom design work for select customers.

Benefits are outstanding including a competitive salary and excellent
relocation package.

Please e-mail me today to find out more information about this exciting
position or call Mark Cline at 952-841-9501.

Thank you for taking the time to read this and for your assistance.

Bridget Arneson
Bond Technologies
7400 Metro Boulevard, Suite 100
Edina, Minnesota 55439-2311

Bond Technologies is a search firm
that specializes in assisting select,
exclusive companies with their
recruitment efforts, primarily in cutting
edge engineering development.
Keywords: ASIC, VLSI, RF, Radio Frequency, Wireless, Research,
Communications, Broadband, DSP

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