In Reply to: Submit your CV and get the best job posted by Boris on 07/02/01 at 3:22 AM:
#13, 3rd cross,
Ph: (Home) +91-80-332 1103
Date of Birth : 30th Dec 1967
Marital status : Married
Issued at Bangalore and valid till 2006
To pursue career in Board design + EDA Technology where my 11years of experience is utilized to achieve leadership position for the organization and my career.
1) Bachelor of Engineering in Computer Science & Engg.
from Bangalore university.
2) Diploma in Computer Science and Eng.
Board of Technical Education (BTE), Bangalore .
Work Experience :
Working as a hardware Engineer involved in board design, designed a Single board computer based on Intel Strong Arm Processor.
Worked as a Sr.Project Engr in Advanced Micronic Devices Ltd.
About 10 years of Experience in EDA division as Sr.Project Engr, engaged in development of component creation, and board design of Single layer and Multi-layer boards and offering various design solutions.
PCB'S DESIGN AS PER IPC - 600C AND MIL 55110E STANDARDS.
CLOSE INTERACTION WITH PCB FABRICATORS.
1) Effective Analytical and Communication skills.
2) Full Flow of Printed Circuit Board level Design from Start-to-Finish process.
3) Expertise in Schematic capture, Simulation , Interactive Place and Route stratagies,
Physical Layout generation.
4) Effective Routing Knowledge in Analog and Digital boards.
5) Knowledge of IPC - 600 CLASS and MIL 55110E PCB Standards.
6) Close Interaction with PCB Fabricators.
7) Gerber generation for fabrication in Gerber x 00 and other formats.
8) ECAM TOOLS ARE USED POST PROCESSING DESIGN JOBS WHICH ARE
USED FOR PCB FABRICATION AND ALLIED ACTIVITIES SUCH AS
VENTING , THEIVING AND PANELIZING AND GENERATING DRILL FILES.
Languages : C, C++, BASIC, FORTRAN, PASCAL, COBOL
ASSEMBLY LAGUAGE : INTEL 8085, 8086, 8087, PDP-11 (now learning ARM)
Operating Systems : MS-DOS, Windows-95/98/2000/NT.
EDA Tools : Cadence's PCB Studio (Allegro, SPECCTRA, Concept-
PCAD 4.5, 5.0, 6.0, 8.0
ORCAD of Cadence (CIS, PSpice A/D, LayoutPlus),
PADS PERFORM , MAX ROUTE.
ECAM UTILITIES : PC - GERBER , GCAM , ECAM
Major Jobs Handled
PROJECT #1 MBPC Single Board Computer
Euro Form Factor
PC - AT Compatible
No 0f Layers 8
Density of the Board 3.52 EIC/Sq. inch
Signal Track Width 8 mil
Mixed Technology Board
PROJECT #2 - Pentium based board for Home PC
Product for Toshiba Japan
ATX Form Factor
No of Layers 4
Density of the Board 3.9 EIC/Sq. inch
Signal Track width 6 mil
Board with SMD,BGA and Through Hole Components.
Impedance matching and shielded tracks.
Split VCC Planes with 9 Voltage Levels.
PROJECT #3 - RISC Processor Based Board Computer
Developed for Parallel Processing based computer
No of layers 8
Density of the board 3.0 EIC/Sq. inch
Signal Track width 8 mil
Mixed Technology board
PROJECT #4 - Digital and Analog Board for ETS
Boards approved by Martin Marietta , USA
No of layers 4 - 10 Layers
Avg. Density 6.0 EIC / Sq. inch
Signal Track Width 6 mil
Mixed Technology boards
12 Different types of boards
PROJECT #5 - Network Board Intel IXE2424 Chip
Network Application board.
Component 3,000 Comps.
No of layers 12 Layers
Avg. Density 6.0 EIC / Sq. inch
Current Project – Intel Strong Arm based Development Platform
Reading - General, Technical, scientific articles, interested in Football, Travelling , very much interested in learning new ideas and concepts, and also interested in music.
Mr. Rajiv K.G. Technical Manager @ Aztec Software Ltd, Ph:5522892/893 ext 357.
Mr. Vinod Mohan Senior Technical Member Intel Bangalore.
Ph: 5550888 ext 266.
Dr.Nagabhushan General Manager, Aspire Communications (P) Ltd.
Ph: 95821 415772/773
Date: 26th March 2002 (D. Srinivasulu)