Back-End tool : Pls reply me with your tool list to meet
Package type "SOT" by this Wednesday.
The tools are for R&D Pilot back-end lines.
Pls send me the tool list with configuration that meet Package type SOT
and wafer 6 inch die.
Trim/Form, Die Bonder, Epoxy Die Attacher, Auto Molding, Laser Marker,
Back grinder, Dicing Saw, Wafer mounter, Lead Inspection System, Ton
Gold ball bonder, Marking machine, Tape mounting station, Bake Oven,
Inner lead bonder, Wire bonder, Wafer Transfer, Burn-in System,
Tester for Power device(SOT package type)
I need a price for the complete line with a minimum number of tools to
complete the line and some details about the equipment you offer me.